High-end Technologies. Powered by RTS.

HOME / About Us / DMS

 

08

Acquired PMS(Productivity Management System) Certificate from Korea Productivity Center

07

Established in KWANG-JU branch for plastic Injection molding business

02

The head office Moved

02

Awarded JangYoungshil Prize from the Government

12

Won a 5 Million Dollars Export Tower Award

10

Awarded a Prize of Sungnam Small and Medium Venture

04

Building Completion of Hyangnam Workplace

03

Awarded a Prize from the Minister of Commerce, Industry and Energy

 

07

Commencement of construction work for Hyangnam Workplace

 

12

Received Venture Company Certificate by SMBA

11

Acquired INNO-Biz Certificate

09

Received Award by the Minister of Commerce, Industry and Energy

03

Acquired ISO9001/14001

02

Converted USA Branch Office to Independent corporation

01

Designated Industrial Family Member by Aju University

 

10

Company Name Changed to RTS Co., Ltd.

10

Partition at per value (from 5,000 won to 500 won)

06

Conducted Paid-in Capital Increase to USD1,600,000

05

Selected as Promising Company from "The Industrial Bank

04

Head office moved

03

Opened Overseas Distribution Agencies in China and Japan

 

12

Re-designated Venture Company by SMBA

09

Designated Promising Company by Kyunggi Province

07

Opened Overseas Distribution Agency in Shanghai, China

06

Opened Overseas Distribution Agency in Singapore

 

02

Company HQ Moved to Sungnam City

 

12

Received Venture Company Certificate by SMBA

12

Designated Excellent Technology Company by Korea Technology Credit Guarantee Fund

09

Designated as Promising Company by IBK BANK

 

02

Established USA Branch Office

 

12

Obtained Certification of Venture Company from
"the Small and Medium Industry Promotion Corporation"

11

1st free issue of the share purchased (Net Capital : 1,441,840,000 Won)

10

Moved into New Office at Boon Dang Techno-Park

10

2nd Issue of the share to be purchased (Net Capital : 514,270,000 Won)

06

1st Issue of new share to be purchased (Net Capital : 450,000,000 Won)

 

12

Established Corporate R&D Center

 

03

Converted to Right-Tek System Coporation (Foundational Capital : 100,000,000 Won)

 

02

Company Establishment

 

08

Acquired patent for classification device of inspection equipment from electronic devices

08

Acquired patent for cleaning device of inspection equipment from electronic devices

08

Acquired patent for classification device of inspection equipment from electronic devices

05

Acquired patent for inspection device from electronic devices

03

Part align apparatus and electronic part discharge method of in apparatus for
dual electronic part inspection

03

Apparatus and Method for Dual Electronic Part Inspection

02

Apparatus and Method for Dual Electronic Part Inspection

08

Part Align apparatus and Electronic part Discharge Method of in a Apparatus for
Dual Electronic Inspection

12

Acquired patent for semiconductor package inspection equipment tray carousel

10

Acquired patent (Inspection device of electronic component)

10

Acquired patent (Inspection of device semiconductor package)

02

Acquired patent (Encoder and decoder in DVR for multi-channel image data processing)

01

Acquired patent (event-driven secure storage for the best picture in DVR system)

08

Acquired patent
(Electronic component scan device from Dual-electronic component inspection system)

12

Trademark Registration

12

Patent (Micro Electronic Component Sorting Method from Dual Type Vision Inspection System)

10

Patent (Real time Traffic Information acquisition Method and System by DMB)

10

Patent (Vision Inspection System and Method for Display Panel Base)

10

Patent (Panel inspection system)

04

Patent (The method of Dual Type Vision Inspection System for Micro Electronic Component)

04

Patent
(The inspection device of dual type vision inspection system for micro electronic component)

02

Component Alignment System for Micro Electronic Component Dual Type Vision Inspection System

02

Brightness Compensation System for LCD

02

Vision Inspection Method for Micro Electronic Component

 

12

Acquired Patent for Electronic part inspection equipment and method using a vision system
(Taiwan)

10

Acquired Patent for Electronic Part Inspection Equipment, available for minute energy

10

Acquired Patent for Electronic part inspection equipment

09

Acquired Patent for Manufacturing Equipment & Method for Liquid Crystal Panel

09

Acquired Patent for Inspection method of Edge line of LCD Panel by Return Line Adaptation

06

Acquired Patent for Measurement method and equipment of semiconductor chip

04

Acquired Patent for Electronic Components using Vision System

02

Acquired Patent for Semiconductor Chip Method and the Measurement of Total Height and
Stand-off of Semiconductor Chip

02

Acquired Patent for Illumination Device

 

11

Completed Micro Chip In-Line System

11

Developed Lead Tap Inspection System

09

Obtained Patent for Panel Flatting Inspection System

08

Developed MCIS-Pro

07

Obtained Patent for Electrical Parts Inspection System and Method

07

Obtained Patent for Tire Cord Inspection Method

06

Developed LCD Panel Appearance Inspection System

04

Obtained Patent for Line Scan Camera in usage of Panda Prism

04

Obtained Patent for Camera Module for Panel Grinding Process

03

Obtained Patent for Grinding System & Progression for LCD Panel manufacturing

03

Obtained Patent for LCD Panel Edge Inspection System

 

11

Developed OLED Module Inspection System

07

Developed LCD Panel Inspection System

05

Developed IR Filter Inspection System

05

Developed Panel Inspection System for LCD Cell

02

Developed Vision Inspection System for 0603mm Multi-Layer Ceramic Chip

 

12

Developed LCD Panel & Pattern Inspection System for Cell-Phone Module

10

Obtained Patent for Micro Chip Vision Inspection

10

Developed MCIS-1800 Vision Inspection System (6 sides inspection)

08

Developed 2D/3D Package Vision System for BGA Leaded & Unleaded packages(2D/3D Semiconductor equipment)

 

12

Obtained Patent for Micro Chip Vision Inspection

11

Contract signed with Samsung Electronics for the development of MCIS

04

Developed Micro Chip inspection system